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| Cure Kinetics | |
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Cure kinetics is used to quantify the extent of chemical reaction or degree of cure. |
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Cure kinetics can predict resin viscosity which changes due to chemical reaction during mold filling. |
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Cure kinetics is also used to predict temperature profiles inside the composite part. |
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Curing models are based on degree of cure measurements by differential scanning calorimetry (DSC). |
| Differential Scanning Calorimetry (DSC) | |||
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Conversion, or degree of cure, under isothermail (T0) conditions. | ||
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| Isothermal Scanning | |||
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| Cure Model (Isothermal Scanning) | |||
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| New Cure Kinetic Model (Dynamic Scanning) | |
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Curing models require as input measurements by differential scanning calorimetry. |
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Conventional calorimetry conducted under "isothermal" conditions can introduce errors in cure modeling due to effects of unavoidable temperature ramping. |
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A new cure kinetic model was developed based on the more robust dynamic scanning calorimetry. |
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The model is a multi-parameter one including effects of temperature ramping and accelerator concentration in the resin. |
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Model predictions were verified by experimental results. |
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| On-line cure monitoring | |
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