| Approach |
|
|
Set up analytical model
to predict residual stress development during cure. |
|
|
Measure material properties,
e.g., relaxation moduli, coefficients of thermal expansion. |
|
|
Measure strains during
curing with embedded strain gagesand fiberoptic sencors (Fobry-Perot). |
|
|
Compare predictions
with experimental results. |
|
|
Combine residual stress
and curing model to optimize curing cycle. |