Residual Stress Determination

Objective
Dertermine curing residual stresses and optimize curing cycle to reduce/or control them.

Approach
Set up analytical model to predict residual stress development during cure.
Measure material properties, e.g., relaxation moduli, coefficients of thermal expansion.
Measure strains during curing with embedded strain gagesand fiberoptic sencors (Fobry-Perot).
Compare predictions with experimental results.
Combine residual stress and curing model to optimize curing cycle.

Relation between curing cycle and degree of cure

Strain development in unidirectional laminate

Residual strain during curing in crossply laminate


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